Saw filter encapsulated in a ceramic package with capacitance in

Details Saw filter encapsulated in a ceramic package with capacitance in Saw filter encapsulated in a ceramic package with capacitance in

1997-02-10

1999-09-07

Pascal, Robert

Wave transmission lines and networks

Coupling networks

Electromechanical filter

333196, 310349, H03H 964

Patent

active

059493054

ABSTRACT:
In a ceramic package for encapsulating a SAW (surface acoustic wave) filter, a metal pad is formed on the bottom of a recess formed in the package. A SAW filter chip is mounted to the package such that propagation paths formed on the chip face the bottom of the recess with the intermediary of a gap. The gap promotes easy impedance adjustment.

REFERENCES:
patent: 5252882 (1993-10-01), Yatsuda
patent: 5281883 (1994-01-01), Ikata et al.
patent: 5459368 (1995-10-01), Onishi et al.
patent: 5699027 (1997-12-01), Tsuji et al.

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