Saw device package and method

Details Saw device package and method Saw device package and method

1996-12-27

1999-04-06

Pascal, Robert J.

Wave transmission lines and networks

Coupling networks

Electromechanical filter

310313R, 310340, 29 2535, 174 522, 174 523, 26427211, 26427216, 361807, 361812, 361813, H03H 905, H01L 41053

Patent

active

058924175

ABSTRACT:
A method for packaging an acoustic wave filter die, and an acoustic wave filter die packaged by the method. The method includes steps of providing an acoustic wave filter die having an active area disposed on a first surface thereof, providing a leadframe including a die flag and sealing the first surface to the die flag. The method also includes steps of molding a plastic package body about the die and the die flag and singulating the plastic body, the die and the die flag. The molding step desirably includes substeps of placing the acoustic wave filter die sealed to the leadframe in a mold, applying a thermosetting plastic material at a suitable temperature less than the glass transition temperature and at a suitable pressure to the acoustic wave filter die sealed to the leadframe in the mold and maintaining the suitable temperature for a suitable period of time.

REFERENCES:
patent: 4699682 (1987-10-01), Takishima
patent: 4927580 (1990-05-01), Nasu et al.
patent: 4993000 (1991-02-01), Niitsuma et al.
patent: 5164328 (1992-11-01), Dunn et al.
patent: 5303457 (1994-04-01), Falkner et al.
patent: 5414214 (1995-05-01), Cho et al.

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