Saw device and method of manufacture

Details Saw device and method of manufacture Saw device and method of manufacture

1990-12-28

1993-05-04

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310344, H01L 4108

Patent

active

052085040

ABSTRACT:
A SAW oscillator package having low vibration sensitivity includes a stiffener layer disposed between a mounting surface for the oscillator and the oscillator circuit package. Preferably, the stiffening layer comprises a slab of a highly stiff material such as a ceramic and, in particular, aluminum oxide, as well as other material which preferably have suitable thermal expansion coefficients matched between the material of the package and the mounting surface. Moreover, the rigidly of the SAW device itself is also increased by either reducing the lateral dimensions of the SAW device or increasing the thickness of the SAW substrate and/or cover.

REFERENCES:
patent: 4213104 (1980-07-01), Cullen et al.
patent: 4270105 (1981-05-01), Parker et al.
patent: 4409570 (1983-10-01), Tanski
patent: 4639697 (1987-01-01), Yarranton et al.
patent: 4933588 (1990-06-01), Greer
patent: 5039957 (1991-08-01), Greer et al.
patent: 5059848 (1991-10-01), Mariani
Bikash K. Sinha, Stanley Locke, "Acceleration and Vibration Sensitivity of SAW Devices", IEEE Transations vol. 34, No. 1 Jan. 1987.

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