Saw device and method of manufacture

Details Saw device and method of manufacture Saw device and method of manufacture

1988-06-29

1994-09-06

Cain, David C.

Wave transmission lines and networks

Coupling networks

Electromechanical filter

333194, 333195, 333197, 310313R, H03H 9205, H01L 4104

Patent

active

053452011

ABSTRACT:
A low vibration sensitive SAW device includes a first quartz substrate having a pair of opposing surfaces, each surface which supports surface wave propagation. A pair of transducers are coupled to each of said surface wave propagation surfaces providing a pair of surface wave devices on opposing surfaces of the substrate. Each surface wave propagating surface is covered by a matching quartz cover and a glass-frit seal to provide a three piece all-quartz package. The pair of devices are connected together in parallel generally externally from the package, and when the dual device package undergoes vibration in a direction perpendicular to the surface wave propagation surfaces, one surface of the substrate will be subjected to a tensile strain field, whereas the opposite surface of the substrate will be subjected to identical but opposite direction strain field that is compressive. The pair of strain fields will induce equal but opposite shifts in resonant frequency of the device which will cancel each other out, providing a SAW device which is substantially invariant with vibration.

REFERENCES:
patent: 4213104 (1980-07-01), Cullen et al.
patent: 4295102 (1981-10-01), Schmidt et al.
patent: 4296347 (1981-10-01), Weirauch
patent: 4462257 (1984-07-01), Gerhart et al.
patent: 4639697 (1987-01-01), Yarranton et al.

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