Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2011-07-12
2011-07-12
Fulk, Steven J (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257SE23181, C438S051000
Reexamination Certificate
active
07977786
ABSTRACT:
An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area.
REFERENCES:
patent: 7005732 (2006-02-01), Horning et al.
patent: 2004/0180464 (2004-09-01), Horning et al.
patent: 2005/0084998 (2005-04-01), Horning et al.
patent: 2008/0080832 (2008-04-01), Chen et al.
European Patent Office, “European Search Report”, May 17, 2010, Published in: EP.
Glenn Max
Horning Robert D.
Nohava James C.
Rekstad Jane
Ridley Jeff A.
Fogg & Powers LLC
Fulk Steven J
Honeywell International , Inc.
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