SAW component with adhesive location and use thereof

Details SAW component with adhesive location and use thereof SAW component with adhesive location and use thereof

2007-05-15

2007-05-15

Summons, Barbara (Department: 2817)

Wave transmission lines and networks

Coupling networks

Electromechanical filter

C428S317700

Reexamination Certificate

active

11407708

ABSTRACT:
The invention is an adhesive, in particular, for components that operate with surface acoustic waves, including a polymer matrix filled with mineral filler particles. The filler is selected from non-conductive or semi-conductive materials and is contained in the adhesive in such a proportion that the total density of the adhesive when cured is greater than 2000 kg/m3.

REFERENCES:
patent: 4494091 (1985-01-01), Goll
patent: 6437412 (2002-08-01), Higuchi et al.
patent: 6556105 (2003-04-01), Nguyen
patent: 2002/0190605 (2002-12-01), Pahl et al.
patent: 2004/0197563 (2004-10-01), Kye
patent: 3729014 (1989-03-01), None
patent: 56-152315 (1981-11-01), None
patent: 56-152316 (1981-11-01), None
patent: 62-141811 (1987-06-01), None
patent: 9-153767 (1997-06-01), None
International Search Report of parent application PCT/EP2004/011779, dated Sep. 12, 2005, pp. 1-3.
Sidney Lees et al.: “Acoustic Properties of Tungsten-Vinyl Composites”, IEEE Transactions on Sonics and Ultrasonics, vol. SU-20, No. 1, Jan. 1973, pp. 1-2.

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