Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-07-18
2006-07-18
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S774000, C439S071000
Reexamination Certificate
active
07079398
ABSTRACT:
A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array. Preferably, the sash is manufactured along with the array of electrical interconnections of the carrier, and during the manufacture the sash provides more homogeneous current density to the outer interconnections of the array during component processing which in turn provides more predictable and consistent surface topography of the carrier and permits more uniform mechanical loading of the interposer or other connector onto the array when assembled.
REFERENCES:
patent: 5199889 (1993-04-01), McDevitt, Jr.
patent: 5437556 (1995-08-01), Bargain et al.
patent: 5653600 (1997-08-01), Ollivier
patent: 5820389 (1998-10-01), Hashiguchi
patent: 5967797 (1999-10-01), Maldonado
patent: 6042412 (2000-03-01), Murr
patent: 6358063 (2002-03-01), Neidich
patent: 6442045 (2002-08-01), Goodwin et al.
U.S. Appl. No. 09/852,998 filed May 10, 2001 entitled Land Grid Array (LGA) Pad Repair Structure and Method by Ma et al.
U.S. Application Serial No. unknown filed Aug. 22, 2001 entitled LGA Connector With Integrated Gasket by Hoffmeyer, IBM.
Tummala and Rymaszewski (eds.)Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, 1989, Chapter 12, pp. 853-919.
Cuneo Kamand
Dinh Tuan
International Business Machines - Corporation
Ojanen Karuna
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