Sandwich structure with double-sided cooling and EMI shielding

Details Sandwich structure with double-sided cooling and EMI shielding Sandwich structure with double-sided cooling and EMI shielding

2010-02-24

2011-11-22

Datskovskiy, Michail V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679460, C361S679540, C361S715000, C361S719000, C165S080300, C165S185000, C174S015100, C174S016300, C174S252000, C257S686000, C257S706000, C257S707000

Reexamination Certificate

active

08064202

ABSTRACT:
A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a bottom structure to achieve double-sided cooling. Meanwhile, the top structure is configured to shield EMI noises as well. The proposed structure further comprises a first set of connecting structures for connecting devices of the mini-modules with the top structure and a second set of connecting structure for connecting the top structure with the bottom structure. The connecting structures are capable of carrying current.

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