Sample processing method and apparatus

Details Sample processing method and apparatus Sample processing method and apparatus

1991-01-07

1993-04-06

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118719, 118723, 20429831, 20429802, H01L 2100

Patent

active

052000176

ABSTRACT:
A method of processing a sample comprises etching the sample by means of an etching plasma, and then treating the sample by means of a second plasma to remove residual corrosive compounds formed by the etching plasma. Removal of the residual corrosive compounds and prevention of corrosion is much improved by contacting the surface of the sample after the second plasma treatment with at least one liquid in order to effect at least one of (a) removal of the residual corrosive compounds and (b) passivation of the surface, and drying the sample.

REFERENCES:
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patent: 4370195 (1983-01-01), Halon et al.
patent: 4487678 (1984-12-01), Noguchi et al.
patent: 4693777 (1987-09-01), Hazano et al.
patent: 4816638 (1989-03-01), Ukai et al.
patent: 4871417 (1989-10-01), Nishizawa et al.
patent: 4886570 (1989-12-01), Davis et al.
patent: 4908095 (1990-03-01), Kagatsume et al.
patent: 4985113 (1991-01-01), Fujimoto et al.
Western Electric Technical Digest No. 21, Jan. 1971, "Wafer Spray Etching, Washing and Drying Apparatus".

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