Sample mount for performing sputter-deposition in a focused...

Details Sample mount for performing sputter-deposition in a focused... Sample mount for performing sputter-deposition in a focused...

2005-09-20

2005-09-20

Versteeg, Steven (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298040, C269S058000

Reexamination Certificate

active

06946064

ABSTRACT:
A method and structure for a sample processing apparatus that uses a vacuum enclosure is disclosed. A focused ion beam tool, sputter target, movable stage, and hinged mount are all included within the vacuum enclosure. The hinged mount includes a sample mounting portion, for holding a sample being processed in the vacuum enclosure, and a counterweight portion. The counterweight portion is connected to the sample mounting portion at an approximate right angle to the sample mounting portion. More specifically, one end of the sample mounting portion is connected to one end of the counterweight portion, such that the sample mounting portion and the counterweight portion form an approximate right angle. There is also an axis around which the mount rotates. The axis passes through the sample mounting portion and the counterweight portion at a location where the sample mounting portion and the counterweight portion connect to one another.

REFERENCES:
patent: 5434422 (1995-07-01), Iwamoto et al.
patent: 5635836 (1997-06-01), Kirtley et al.
patent: 5922179 (1999-07-01), Mitro et al.
patent: 6407850 (2002-06-01), Rojo et al.
patent: 6783596 (2004-08-01), Schaefer et al.
patent: 2002/0005492 (2002-01-01), Hashikawa et al.
patent: 2002/0050565 (2002-05-01), Tokuda et al.

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