Sample inspection system

Details Sample inspection system Sample inspection system

2006-06-20

2006-06-20

Pham, Hoa Q. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237500

Reexamination Certificate

active

07064821

ABSTRACT:
A curved mirrored surface is used to collect radiation scattered by a sample surface and originating from a normal illumination beam and an oblique illumination beam. The collected radiation is focused to a detector. Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors to restrict detection to certain azimuthal angles.

REFERENCES:
patent: 4360275 (1982-11-01), Louderback
patent: 4378159 (1983-03-01), Galbraith
patent: 4395126 (1983-07-01), Kramer
patent: 4449818 (1984-05-01), Yamaguchi
patent: 4540286 (1985-09-01), Satake et al.
patent: 4558949 (1985-12-01), Uehara et al.
patent: 4589773 (1986-05-01), Ido et al.
patent: 4598997 (1986-07-01), Steigmeier et al.
patent: 4669875 (1987-06-01), Shiba et al.
patent: 4740079 (1988-04-01), Koizumi et al.
patent: 4794265 (1988-12-01), Quackenbos et al.
patent: 4861164 (1989-08-01), West
patent: 4893032 (1990-01-01), Braden
patent: 4893932 (1990-01-01), Knollenberg
patent: 4898471 (1990-02-01), Stonestrom et al.
patent: 4929845 (1990-05-01), Amir et al.
patent: 4966457 (1990-10-01), Hayano et al.
patent: 5058982 (1991-10-01), Katzir
patent: RE33956 (1992-06-01), Line et al.
patent: 5125741 (1992-06-01), Okada et al.
patent: 5155372 (1992-10-01), Bowen et al.
patent: 5189481 (1993-02-01), Jann et al.
patent: 5245403 (1993-09-01), Kato et al.
patent: 5389794 (1995-02-01), Allen et al.
patent: 5416594 (1995-05-01), Gross et al.
patent: 5424838 (1995-06-01), Siu
patent: 5463459 (1995-10-01), Morioka et al.
patent: 5465145 (1995-11-01), Nakashige et al.
patent: 5486919 (1996-01-01), Tsuji et al.
patent: 5530550 (1996-06-01), Nikoonahad et al.
patent: 5608526 (1997-03-01), Piwonka-Corle et al.
patent: 5650614 (1997-07-01), Yasutake et al.
patent: 5672885 (1997-09-01), Allen et al.
patent: 5712701 (1998-01-01), Dementi et al.
patent: 5798829 (1998-08-01), Vaez-Iravani
patent: 5929983 (1999-07-01), Lu
patent: 5940175 (1999-08-01), Sun
patent: 6084664 (2000-07-01), Matsumoto et al.
patent: 6118525 (2000-09-01), Fossey et al.
patent: 6169601 (2001-01-01), Eremin et al.
patent: 6201601 (2001-03-01), Vaez-Iravani et al.
patent: 6292259 (2001-09-01), Fossey et al.
patent: 6384910 (2002-05-01), Vaez-Iravani et al.
patent: 6538730 (2003-03-01), Vaez-Iravani et al.
patent: 6618134 (2003-09-01), Vaez-Iravani et al.
patent: 6639662 (2003-10-01), Vaez-Iravani et al.
patent: 6657714 (2003-12-01), Almogy et al.
patent: 6657715 (2003-12-01), Vaez-Iravani et al.
patent: 2001/0052975 (2001-12-01), Biellak et al.
patent: 2003/0206295 (2003-11-01), Vaez-Iravani et al.
patent: 2003/0210393 (2003-11-01), Vaez-Iravani et al.
patent: 2004/0057045 (2004-03-01), Vaez-Iravani et al.
patent: 4123916 (1992-01-01), None
patent: 0624787 (1994-11-01), None
patent: 0 715 147 (1996-06-01), None
patent: 1 023 582 (2003-11-01), None
patent: 1 265 063 (2005-01-01), None
patent: 57-13340 (1982-01-01), None
patent: 63-140904 (1988-06-01), None
patent: 63-285449 (1988-11-01), None
patent: WO96/15354 (1996-09-01), None
patent: WO97/04134 (1997-03-01), None
patent: 97/12226 (1997-04-01), None
patent: WO97/12226 (1997-04-01), None
patent: WO96/33158 (1997-09-01), None
patent: WO99/14575 (1999-03-01), None
“Surface Inspection System for Estimation of Wafer,” Y. Yatsugake et al.,Hitachi Electronics Engineering Technical Report,vol. 11, Jan. 1996, pp. 21-26.
Figure, Hitachi Electronics Engineering Co., Ltd., presented by Etsuro Morita of Mitsubishi Materials Silicon Corp. in a presentation entitled “Exploration of COP and COP Defect Crystal Originated ‘Particles’.” at the 6thInternational Workshop on 300 Millimeter Wafers on Dec. 5, 1996 in Makuhari. Japan.
Partial European Search Report dated Oct. 18, 2000.
Search Report Corresponding to PCT Application No. PCT/US98/19564 issued by the International Patent Office on Feb. 8, 1999.
European Patent Office “Partial European Search Report”, mailed in related EP 04024371 on Jan. 2, 2005, 5 pages.
“Integrating Sphere Theory,” Laser Beam Measurement, Melles Griot, printed Aug. 6, 2004, pp. 1-5.
“Integrating Sphere,” Glossary, The Practical Application of Light, Melles Griot, printed Aug. 6, 2004, 1 page.
“Bespoke Integrating Spheres Now Off-the-Shelf,” Laboratorytalk, Product News, Pro-Lite Technology, May 14, 2004, 2 pages.
“Integrating Sphere Fabrication and Coating,” Labsphere, Applications, printed Aug. 6, 2004, 1 page.
“A Guide to Reflectance coatings and Materials,” Techguide, Labsphere, 8 pages.
“Integrating Spheres,” Spectral Products, 2003, 2 pages.
Knollenberg, “The Importance of media Refractive Index in Evaluating Liquid and Surface Microcontamination Measurements,”Particle Measuring Systems, Boulder CO, Mar./Apr. 1987, 9 pages.
Wagner et al., “Requirements for Future Surface Inspection Equipments for Bare Silicon Surfaces”, Wacker-Chemitronic GmbH, Burghausen, Germany, 8 pages.
Notification of Transmittal of International Preliminary Examination Report, dated Feb. 1, 2000, issued in corresponding PCT/US98/19564, 5 pages.
Written Opinion, dated Aug. 31, 1999, issued in corresponding PCT/US98/19564, 5 pages.
Communication issued in correspding EP Application No. 04024371.9, dated Mar. 30, 2005, transmitting the European Search Report, 5 pages.

Affiliated with

Also associated with

Rating

Sample inspection system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sample inspection system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sample inspection system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3683112