Same-side gated process for encapsulating semiconductor devices

Details Same-side gated process for encapsulating semiconductor devices Same-side gated process for encapsulating semiconductor devices

1992-09-11

1993-10-19

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437212, 437219, 26432812, 26427217, H01L 2160

Patent

active

052545016

ABSTRACT:
A transfer molding process for encapsulating a semiconductor device, such as an integrated circuit, in plastic. The semiconductor device is mounted on and electrically connected to a leadframe, the leadframe is placed in a preheated mold with the device and electrical connections disposed in a cavity and preheated thermosetting plastic molding compound is injected into the cavity through a gate located on the same side of the mold cavity as the device and electrical connections.

REFERENCES:
patent: 4812420 (1989-03-01), Matsuda et al.
patent: 4900501 (1990-02-01), Saeki et al.
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5013688 (1991-05-01), Yamazaki et al.
patent: 5077237 (1991-12-01), Hara
patent: 5096853 (1992-03-01), Yasunaga et al.
patent: 5133921 (1992-07-01), Yokoyama
patent: 5182071 (1993-01-01), Knapp et al.
patent: 5200366 (1993-04-01), Yamada et al.

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