Salvage method and apparatus for recovering microelectronic comp

Details Salvage method and apparatus for recovering microelectronic comp Salvage method and apparatus for recovering microelectronic comp

1996-12-31

1999-07-27

Ryan, Patrick

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228 19, B23K 1018

Patent

active

059275910

ABSTRACT:
A salvage device facilitates detaching a plurality of components soldered to a plurality of modules used in printed circuit board assemblies. In one embodiment, a salvage device has a component receptacle with a component receiver that is adapted to hold a plurality of detached components. The salvage device also has a module holder attached to the component receptacle. In operation, the module holder suspends a plurality of modules over the component receiver to space the components attached to the modules apart from the component receiver. The salvage device is then placed in an oven to melt the solder contacts that bond the components to the modules. After the solder contacts reach a molten state, the components are preferably separated from the module by vibrating the components and the modules to break the surface tension of the molten solder. The components then fall into the component receiver and are removed from the oven.

REFERENCES:
patent: 5148969 (1992-09-01), Boucher et al.
patent: 5214849 (1993-06-01), Jones, Jr.
patent: 5722579 (1998-03-01), Yu et al.

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