Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Reexamination Certificate
1998-05-01
2001-01-23
Williams, Alexander O. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Device held in place by clamping
C257S730000, C257S731000, C257S668000, C257S732000, C257S417000, C257S419000, C257S724000, C257S693000, C257S726000, C257S718000, C257S414000, C257S704000, C073S718000, C073S727000, C073S756000, C073S721000, C073S726000, C073S724000, C073S754000, C361S283400, C361S813000, C338S042000
Reexamination Certificate
active
06177727
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates, in general, to semiconductor components and, more particularly, to mounting semiconductor devices to a substrate.
BACKGROUND OF THE INVENTION
Typically, semiconductor devices such as sensors are manufactured by mounting a semiconductor chip to a leadframe, electrically connecting die pads on the semiconductor chip to leadframe leads, and enclosing the semiconductor chip and a portion of the leadframe within a packaging material. The semiconductor device is then mounted to a substrate by soldering the leads to corresponding bond pads on a substrate such as a Printed Circuit Board (PCB). In the example of a sensor, one or both sides of the semiconductor chip are exposed to an ambient environment via ports that are adhesively coupled to the packaging material.
A drawback with this type of sensor is that the packaging material, the material of the ports, and the adhesive material each have different coefficients of thermal expansion. Thus, when the semiconductor device is thermally stressed, the materials expand or contract at different rates, imparting a mechanical stress on the semiconductor die. The semiconductor die, which contains the sensor transducer, then produces erroneous results. Therefore, the sensor produces erroneous results. Another drawback to this type of sensor is that the step of soldering the leads to the substrate imparts a mechanical stress on the semiconductor die so that the sensor produces erroneous results.
Accordingly, it would be advantageous to have an apparatus and method for reducing stress on a semiconductor die. It would be of further advantage for the apparatus to be have a small form factor and be easily and cost effectively integrated into standard manufacturing processes.
REFERENCES:
patent: 4670730 (1987-06-01), Takeda et al.
patent: 5033032 (1991-07-01), Houghtaling
patent: 5661245 (1997-08-01), Svoboda et al.
patent: 5686698 (1997-11-01), Mahadevan et al.
patent: 5693882 (1997-12-01), Englund et al.
patent: 5714738 (1998-02-01), Hauschulz et al.
patent: 5805430 (1998-09-01), Atwood et al.
patent: 5834834 (1998-11-01), Lee et al.
patent: 5859759 (1999-01-01), Moriyama et al.
patent: 5945736 (1999-08-01), Rife et al.
patent: 5948992 (1999-09-01), Yamamoto
patent: 5956018 (1999-09-01), Pejic et al.
patent: 6012600 (2000-01-01), Pham et al.
patent: 6018194 (2000-01-01), Moss et al.
patent: 6018249 (2000-01-01), Akram et al.
patent: 6043667 (2000-03-01), Cadwallader et al.
patent: 6066882 (2000-05-01), Kato
patent: 6079276 (2000-06-01), Frick et al.
patent: 6122974 (2000-09-01), Sata et al.
Hart, Jr. John W.
McDonald William G.
Wallace, Jr. Daniel John
Martinez Anthony M.
Motorola Inc.
Williams Alexander O.
LandOfFree
Saddle bracket for solid state pressure gauge does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Saddle bracket for solid state pressure gauge, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Saddle bracket for solid state pressure gauge will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2454393