Sacrificial metal etchback system

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

156643, 156656, 118723R, 118728, H01L 2100

Patent

active

053306074

ABSTRACT:
An etchback apparatus for use in integrated circuit processing after via fill to remove excess metal and leave plugged vias, has a sacrificial ring with a surface consisting substantially of a metal that etches much like the metal used to fill the vias. The excess surface area in the process provides sacrificial metal so microloading is avoided. he metal used to fill the vias.

REFERENCES:
patent: 4350578 (1982-09-01), Frieser et al.
patent: 4563240 (1986-01-01), Shibata et al.
patent: 4793975 (1988-12-01), Drage
patent: 4980018 (1990-12-01), Mu et al.

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