Run-to-run control method for automated control of metal...

Details Run-to-run control method for automated control of metal... Run-to-run control method for automated control of metal...

2008-01-29

2008-01-29

Jarrett, Ryan A. (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C438S005000

Reexamination Certificate

active

07324865

ABSTRACT:
A method is provided, the method comprising monitoring consumption of a sputter target to determine a deposition rate of a metal layer during metal deposition processing using the sputter target, and modeling a dependence of the deposition rate on at least one of deposition plasma power and deposition time. The method also comprises applying the deposition rate model to modify the metal deposition processing to form the metal layer to have a desired thickness.

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Smith, T.H., Boning, D.S., Stefani, J. and Butler, S.W. “Run by Run Advanced Process Control of Metal Sputter Deposition”. IEEE Transactions on Semiconductor Manufacturing 11.2 (1998): 276-284.

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