Ruggedized electronic module cooling system

Details Ruggedized electronic module cooling system Ruggedized electronic module cooling system

2005-12-13

2005-12-13

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C165S080300, C165S185000

Reexamination Certificate

active

06975511

ABSTRACT:
A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic device supported by the housing. The ruggedized electronics sub-system module also includes an electrical connector coupled to the electronic device and supported by the housing. The ruggedized electronics sub-system module further includes a plurality of ruggedized cooling pins extending from the housing. The plurality of pins are spaced so as to allow for natural convective currents or forced air to be used for cooling the electronic device.

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Co-pending patent application entitled “Modular Electronics System Package” filed on an even date, inventor S. Lebo.
Co-pending patent application entitled “Modular Electronics System Chassis” filed on an even date inventor S. Lebo.
Co-pending patent application entitled “Ruggedized Electronics Sub-System Module” filed on an even date, inventor S. Lebo.
Co-pending patent application entitled “Electronic Module Restraint Apparatus” filed on an even date, Inventor S. Lebo and S. Sellner.
Co-pending patent application entitled “Restraint Apparatus For An Electronics Module” filed on an even date, inventor S. Lebo.
“SINCGARS, Evolution to Revolution”, ITT Industries (www.acd.itt.com).
U.S. Appl. No. 10/229,877, titled Software Radio System and Method, filed Aug. 28, 2002.
U.S. Appl. No. 10/229,941, titled Modular Communication Platform, filed Aug. 28, 2002.

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