Ruggedized computer capable of operating in high-temperature...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S679520, C361S700000, C361S704000, C361S710000, C361S714000, C165S080300, C165S080400, C165S104210, C165S104330, C165S185000

Reexamination Certificate

active

08031464

ABSTRACT:
Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment.

REFERENCES:
patent: 4046193 (1977-09-01), Dougherty
patent: 4642715 (1987-02-01), Ende
patent: 5243493 (1993-09-01), Jeng et al.
patent: 5455739 (1995-10-01), Barden
patent: 5570270 (1996-10-01), Naedel et al.
patent: 5731954 (1998-03-01), Cheon
patent: 6038129 (2000-03-01), Falaki et al.
patent: 6104611 (2000-08-01), Glover et al.
patent: 6111750 (2000-08-01), Gates
patent: 6178088 (2001-01-01), Gates
patent: 6209631 (2001-04-01), Garcia-Ortiz
patent: 6234240 (2001-05-01), Cheon
patent: 6252726 (2001-06-01), Verdiell
patent: 6289678 (2001-09-01), Pandolfi
patent: 6407911 (2002-06-01), Spence et al.
patent: 6434000 (2002-08-01), Pandolfi
patent: 6765793 (2004-07-01), Kehret et al.
patent: 6796372 (2004-09-01), Bear
patent: 6798661 (2004-09-01), Barsun et al.
patent: 6944022 (2005-09-01), Kehret et al.
patent: 7012807 (2006-03-01), Chu et al.
patent: 7072179 (2006-07-01), Curran et al.
patent: 7130193 (2006-10-01), Hirafuji et al.
patent: 7177154 (2007-02-01), Lee
patent: 7277286 (2007-10-01), Lee
patent: 7286365 (2007-10-01), Sarno et al.
patent: 7295436 (2007-11-01), Cheon
patent: 7301776 (2007-11-01), Wang et al.
patent: 7365982 (2008-04-01), He
patent: 7447017 (2008-11-01), Koo
patent: 7633757 (2009-12-01), Gustine et al.
patent: 7719828 (2010-05-01), Brown et al.
patent: 7747787 (2010-06-01), Lum
patent: 7845395 (2010-12-01), Chu
patent: 2004/0218362 (2004-11-01), Amaro et al.
patent: 2005/0060444 (2005-03-01), Lum
patent: 2005/0168941 (2005-08-01), Sokol et al.
patent: 2005/0286229 (2005-12-01), Ku
patent: 2006/0267192 (2006-11-01), Chen
patent: 2007/0263355 (2007-11-01), Yu et al.
patent: 2008/0064524 (2008-03-01), Bryant et al.
patent: 2008/0177899 (2008-07-01), Lum
patent: 10311526 (2004-09-01), None
patent: 02002100892 (2002-04-01), None
Authorized Officer G. Anastassiades, PCT/US2009/056204; International Search Report and Written Opinion of the International Searching Authority, Dec. 3, 2009, 9 pgs.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ruggedized computer capable of operating in high-temperature... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ruggedized computer capable of operating in high-temperature..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ruggedized computer capable of operating in high-temperature... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4286957

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.