Row slicing method in tape head fabrication

Details Row slicing method in tape head fabrication Row slicing method in tape head fabrication

2005-03-08

2005-03-08

Nguyen, Dung Van (Department: 3723)

Stone working

Sawing

C125S013010

Reexamination Certificate

active

06863061

ABSTRACT:
A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.

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