Routing topology for identical connector point layouts on primar

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361783, 361792, H05K 114, H05K 116, H05K 118

Patent

active

061186694

ABSTRACT:
Under one aspect of the invention, the invention includes a multilayered substrate. The substrate includes a primary side having a first group of connection points, including a first connection point, having a first layout to interface with a first chip. The substrate also includes a secondary side having a second group of connection points, including a second connection point, having a layout identical to the first layout, to interface with a second chip. The substrate also includes an intermediate connection point coupled to the first and second connection points through first and second branch traces each having substantially the same electrical length.

REFERENCES:
patent: 5144578 (1992-09-01), Sakagami
patent: 5557564 (1996-09-01), Haraguchi et al.
patent: 5831890 (1998-11-01), Selna et al.
patent: 5838627 (1998-11-01), Tomishima et al.
patent: 5841686 (1998-11-01), Chu et al.
patent: 5856937 (1999-01-01), Chu et al.

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