Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating moving substrate
Patent
1998-10-30
2000-06-20
Valentine, Donald R.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating moving substrate
205148, 205157, 205291, 205671, 204212, 204224R, 204224M, 204273, C25D 500, C25D 520, C25D 1700, C25F 330, C25F 700
Patent
active
060774126
ABSTRACT:
A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field, and in which a rotating anode is used to agitate and distribute the electrolyte. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while a rotating anode is used to agitate and distribute the electrolyte. With a stationary sleeve, fluid feed and evacuation lines can be coupled through the sleeve to access the containment chamber.
REFERENCES:
patent: 4391694 (1983-07-01), Runsten
patent: 5000827 (1991-03-01), Schuster et al.
patent: 5024746 (1991-06-01), Stierman et al.
patent: 5256274 (1993-10-01), Poris
patent: 5368711 (1994-11-01), Poris
patent: 5429733 (1995-07-01), Ishida
patent: 5437777 (1995-08-01), Kishi
patent: 5441629 (1995-08-01), Kosaki
patent: 5447615 (1995-09-01), Ishida
patent: 5516414 (1996-05-01), Glafenhein et al.
patent: 5597460 (1997-01-01), Reynolds
patent: 5830805 (1998-11-01), Shacham-Diamand et al.
patent: 5853559 (1998-12-01), Tamaki et al.
patent: 5865984 (1999-02-01), Corbin, Jr.
patent: 5932076 (1999-08-01), Gubig
Contolini, R., et al., A Copper Via Plug Process by Electrochemical Planarization, 1993, VMIC Conference-102/93/0470, Jun. 8-9, 1993, pp. 470-477.
Pai, Pei-Lin & Ting, Chiu, Copper as the Future Interconnection Material, 1989, VMIC Conference, TH-0259-2/89/0000-0258, Jun. 12-13, 1989, pp. 258-264.
Contolini, R., et al., Copper Electroplating Process for Sub-Half-Micron-ULSI Structures, 1995 VMIC Conference--104/95/0322, Jun. 27-29, 1995, pp. 322-328.
Ting, Chiu H., et al., Recent Advances in Cu Metallization, 1996 VMIC Conference, 106/96/0481(c), Jun. 18-20, 1996, pp. 481-486.
Contolini, Robert J., et al., Electrochemical Planarization for Multilevel Metallization, J. Electrochem. Soc., vol. 141, No. 9, Sep. 1994, pp. 2503-2510.
Equinox--Single Substrate Processing System, A Semitool Brochure, EQU025-Apr. 1994, pp. 1.8--8.8.
Holtkamp William H.
Ko Wen C.
Ting Chiu H.
Cutek Research, Inc.
Valentine Donald R.
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