Rotatable pick and place vacuum sense head for die bonding appar

Details Rotatable pick and place vacuum sense head for die bonding appar Rotatable pick and place vacuum sense head for die bonding appar

1987-07-20

1989-01-24

Spar, Robert J.

Material or article handling

Vertically swinging load support

Grab

29568, 414912, 901 40, 294 641, B66C 102

Patent

active

047998547

ABSTRACT:
A pick and place head for transferring die or chips containing electronic circuitry from waffle packs to substrates prior to lead bonding operations. The pick and place head includes a spindle rotatably mounted at the end of an arm and carrying jaws which are extendable to grasp, retract and rotate a collet having a vacuum pickup tip. Embodied as part of the spindle is a vacuum sensor manifold which sealably receives the collet and cooperates with it to form part of a vacuum sensing system to detect pickup of the chip or die.

REFERENCES:
patent: Re32538 (1987-11-01), Hawkswell
patent: 4135630 (1979-01-01), Snyder et al.
patent: 4515507 (1985-05-01), Asai et al.
patent: 4604787 (1986-08-01), Sievers, Jr.
patent: 4611397 (1986-09-01), Janisiewicz et al.
patent: 4611846 (1986-09-01), Feiber et al.
patent: 4620362 (1986-11-01), Reynolds
patent: 4635328 (1987-01-01), Palmer
patent: 4723353 (1988-02-01), Monforte

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