Rotary type apparatus for processing semiconductor wafers and me

Coating apparatus – Gas or vapor deposition – Multizone chamber

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Details

20429825, 156345, 29 2501, C23C 1600

Patent

active

056118619

ABSTRACT:
The present invention provides a semiconductor wafer processing apparatus including (a) N process chambers for processing a semiconductor wafer therein wherein N is a positive integer greater than 1, the N process chambers being rotatably disposed in a circle having a first diameter and circumferentially equally spaced away from each other, (b) at least one pair of wafer transferring devices for transferring a semiconductor wafer into and taking a semiconductor wafer out of one of the N process chambers, the wafer transferring devices being disposed in a circle having a second diameter greater than the first diameter, the wafer transferring devices being circumferentially equally spaced away from each other at the same spacing as the N process chambers, and (c) a driver for rotating the N process chambers so that any two process chambers among the N process chambers face to the wafer transferring devices. The semiconductor wafer processing apparatus makes it possible to concurrently transfer and process semiconductor wafers, thereby enhancing a throughput without causing a semiconductor wafer to wait to be processed.

REFERENCES:
patent: 4984531 (1991-01-01), Zejda
patent: 5186718 (1993-02-01), Tepman
patent: 5205919 (1993-04-01), Zejda

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