Rotary signal coupling for chemical mechanical polishing endpoin

Details Rotary signal coupling for chemical mechanical polishing endpoin Rotary signal coupling for chemical mechanical polishing endpoin

1996-03-19

1998-06-23

Snow, Walter E.

Electricity: measuring and testing

Magnetic

Combined

324234, 324 715, 1566261, 1566271, H01L 21302, G01B 706

Patent

active

057709483

ABSTRACT:
An apparatus for rotary signal coupling in in-situ monitoring of a chemical-mechanical polishing process by a polisher is provided with a sensor fixed to a rotatable wafer carrier for creating a signal responsive to the chemical mechanical polishing process, a conductor coupled to the sensor for receiving the signal, the conductor fixed to the rotatable wafer carrier, a contact coupled to the conductor, the contact fixed to a stationary drive arm, and signal transfer means coupled to the contact for transferring the signal to a monitoring means.

REFERENCES:
patent: 5559428 (1996-09-01), Li et al.

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