Cutting – Other than completely through work thickness or through work... – Scoring
Patent
1993-09-20
1996-02-06
Jones, Eugenia
Cutting
Other than completely through work thickness or through work...
Scoring
83346, 83669, 8369842, B26D 308, B26F 144
Patent
active
054888891
ABSTRACT:
A cutting die for cutting materials is provided. A die sheet having opposing front and back die sheet surfaces is provided. At least one cutting edge defining a die pattern is formed extending outwardly from a portion of the front sheet surface. A spacer abutment extending outwardly from a portion of the back surface of the die sheet is also provided. The spacer abutment is disposed in alignment with the cutting edge. A pressure surface is provided for applying the die sheet to the materials. An abutment surface of the spacer is abutted directly against the carrier surface in order to dispose the cutting edge a predetermined distance from the pressure surface. Cavities formed between adjacent abutments may be filled with an adhesive material in order to secure the cutting die to the pressure surface. The cutting die may be flexible and may be adhesively secured to a cylindrical die carrier.
REFERENCES:
patent: 3257885 (1966-06-01), Hornung
patent: 3744384 (1973-07-01), Jarritt et al.
patent: 3850059 (1974-11-01), Kang
patent: 3937109 (1976-02-01), Korner et al.
patent: 4393738 (1983-07-01), Heyden
patent: 4561355 (1985-12-01), Cuir et al.
Jones Eugenia
Xynatech, Inc.
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