Metal fusion bonding – Process – Plural joints
Patent
1987-02-24
1988-03-01
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228242, 228248, B23K 3102
Patent
active
047280239
ABSTRACT:
A process for vapor phase soldering of electronic components comprises applying to the surface of a substrate or to the surface of components on such substrate a solder cream comprising 85 to 90% of finely divided solder metal and 10 to 15% of a fluorinated tertiary alkylamine, preferably a perfluorotrihexyl amine, by weight of the sum of the two components, and positioning electronic components on the substrate, with contacts of such components on the solder cream-coated surface. The substrate is placed in a chamber in contact with the boiling vapors of a second liquid fluorinated tertiary alkylamine having a lower boiling point than the fluorinated tertiary alkylamine in the solder cream, preferably perfluorotriamyl amine, in the chamber, and melting the solder metal in the solder cream and fusing the solder joints of the electronic components to form solder joints substantially free of organic residue. The fluorinated tertiary alkylamine in the solder cream dissolves in the lower boiling point fluorinated tertiary alkylamine in the chamber, and can be recovered from the solution by distillation for reuse.
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patent: 4504007 (1985-03-01), Anderson, Jr. et al.
patent: 4549686 (1985-10-01), Sargent et al.
patent: 4580716 (1986-04-01), Barresi et al.
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Barajas Felix
Bridges Donald W.
Geldin Max
Godici Nicholas P.
McDonnell Douglas Corporation
Seidel Richard K.
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