Rosin-free solder composition

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252514, 252500, A01B 106

Patent

active

046735321

ABSTRACT:
A solder composition or solder cream especially adapted for vapor phase soldering in electronic circuits without formation of organic residues, comprises a major portion of finely divided solder metal and a minor portion of a fluorinated tertiary alkylamine. Preferably, the composition consists essentially of 85 to 90% of solder metal and 10 to 15% of perfluorotrihexyl amine. A small amount of an organic brominated activator such as homocyclohexane, can be added to convert any lead oxide or tin oxide present in the solder metal, to the corresponding bromides, and a small amount of solvent can be incorporated to disperse the activator in the solder composition. The fluorinated amine vehicle of the solder cream is compatible with and dissolves in the perfluorotriamyl amine, commonly used as the heating medium in vapor phase soldering, and the amine vehicle, perfluorotrihexyl amine, can be recovered from the solution by distillation, for reuse.

REFERENCES:
patent: 4391742 (1983-07-01), Steigerwald et al.
patent: 4535012 (1985-08-01), Martin et al.
patent: 4595604 (1986-06-01), Martin et al.
patent: 4595605 (1986-06-01), Martin et al.
patent: 4595606 (1986-06-01), Martin et al.

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