Metal treatment – Compositions – Fluxing
Patent
1994-09-09
1996-11-05
Silverberg, Sam
Metal treatment
Compositions
Fluxing
148 24, B23K 3534
Patent
active
055713408
ABSTRACT:
A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8% by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10% by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.
REFERENCES:
patent: 2470957 (1949-05-01), Strader
patent: 3099590 (1963-02-01), Laudenslager
patent: 3746620 (1973-07-01), Vance
patent: 3840411 (1974-11-01), Rozzi
patent: 3925112 (1975-12-01), Peterson, Sr. et al.
patent: 4000016 (1976-12-01), Lazzarini et al.
patent: 4077815 (1978-03-01), Schuessler
patent: 4098621 (1978-07-01), Strauss et al.
patent: 4113524 (1978-09-01), Katz
patent: 4140554 (1979-02-01), Stayner et al.
patent: 4151015 (1979-04-01), Cooper
patent: 4568395 (1986-02-01), Nabhani
patent: 4601763 (1986-07-01), Stratil et al.
patent: 4661173 (1987-04-01), Barajas et al.
patent: 4708751 (1987-11-01), Froebel et al.
patent: 4759490 (1988-07-01), Ochiai
patent: 4895606 (1990-01-01), Jafri
patent: 4940498 (1990-07-01), Rubin
patent: 4988395 (1991-01-01), Taguchi et al.
patent: 4994119 (1991-02-01), Gutierrez et al.
patent: 5004509 (1991-04-01), Bristol
patent: 5009724 (1991-04-01), Dodd et al.
patent: 5069730 (1991-12-01), Dodd et al.
patent: 5085365 (1992-02-01), Turner
patent: 5131962 (1992-07-01), Minahara et al.
patent: 5141568 (1992-08-01), Turner et al.
patent: 5145531 (1992-09-01), Turner et al.
patent: 5281281 (1994-01-01), Stefanowski
patent: 5297721 (1994-03-01), Schnieder et al.
Blumel David B.
Brous Jack
Schneider Alvin F.
Fry's Metals, Inc.
Silverberg Sam
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