Room temperature storage-stable, heat-curable, low CTE, one comp

Details Room temperature storage-stable, heat-curable, low CTE, one comp Room temperature storage-stable, heat-curable, low CTE, one comp

1997-03-19

1999-01-12

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523219, 523428, 523466, C08L 6300

Patent

active

058590960

ABSTRACT:
The present invention pertains to a one component curable epoxy resin composition which is storage-stable at ambient temperature and which maintains a post-cured high glass transition temperature (Tg) of above 130.degree. C. and a low coefficient of thermal expansion (CTE) of less than 1.76.times.10.sup.-5 cm/cm/.degree.C. over a temperature range of -30.degree. to 125.degree. C., and thus finds practical utility in tooling applications. The epoxy resin composition comprises an epoxy resin or mixture thereof, a multifunctional epoxy resin diluent, a boron trichloride amine complex, and at least one filler selected from the group consisting of a silica or a silicate. The invention also relates to the cured product.

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Ellis, Chemistry & Technology of Epoxy Resins, pp. 24-27, 118-125, 232-235, 318-319.

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