Room-temperature stable, one-component, electrically-conductive,

Details Room-temperature stable, one-component, electrically-conductive, Room-temperature stable, one-component, electrically-conductive,

1995-07-19

1996-11-19

McGinty, Douglas J.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252512, H01B 122

Patent

active

055759564

ABSTRACT:
A flexible electrically-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore A reading of 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) an electrically-conductive filler comprising a metal. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks as a single component mixture at room temperature and is curable in less than two hours at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than 95 and a volume resistivity less than about 10.sup.-2 ohm-cm at room temperature.

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