Metal fusion bonding – Process – Using high frequency vibratory energy
Patent
1997-02-26
1999-11-16
Evans, Geoffrey S.
Metal fusion bonding
Process
Using high frequency vibratory energy
228 11, B23K 2010
Patent
active
059841621
ABSTRACT:
An apparatus (304) and method is provided for bonding wire (104) to bond sites (108) of integrated circuits (110), lead frames, and packages at room temperatures. In preferred embodiments a ball end (106) of a gold wire (104) is bonded to an aluminum bond pad (108). Apparatus (304) includes a high frequency ultrasonic energy source (306) designed to provide ultrasonic energy at frequencies above 200 kHz. The ultrasonic energy is transmitted to the bonding interface via capillary (302). In this manner, a strong bond is formed between ball end (106) and bonding site (108). The apparatus and method provided enable bonds of sufficient shear strength to be fabricated in a sufficiently short bonding time even at ambient temperatures, enabling the efficient fabrication of temperature sensitive devices such as micromechanical structures.
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Hogan Timothy J.
Hortaleza Edgardo R.
Brill Charles A.
Donaldson Richard L.
Evans Geoffrey S.
Knapp Jeffrey T.
Telecky Jr. Frederick J.
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