Roll-to-roll fabricated encapsulated semiconductor circuit...

Details Roll-to-roll fabricated encapsulated semiconductor circuit... Roll-to-roll fabricated encapsulated semiconductor circuit...

2011-01-04

2011-01-04

Luu, Chuong A. (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S788000, C257S795000, C257S796000

Reexamination Certificate

active

07863760

ABSTRACT:
An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements having a first conductor and a second conductor. The encapsulated semiconductor device includes an adhesive having the pattern of semiconductor elements fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination, the adhesive being activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor is automatically brought into and maintained in electrical communication with the electrically conductive pattern of the second substrate and so that the other of the first conductor and the second conductor of each semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface.

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