Roll-on encapsulation method for semiconductor packages

Details Roll-on encapsulation method for semiconductor packages Roll-on encapsulation method for semiconductor packages

2008-10-01

2010-11-09

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S112000, C438S113000, C438S124000, C438S126000

Reexamination Certificate

active

07829389

ABSTRACT:
A low-viscosity resin is deposited using an apparatus with a movable and heatable wheel and a heater stage. A tape is provided, which includes a layer (140) of an adhesive polymeric resin and a film (141) of an inert plastic compound. The tape is wrapped around the wheel (150) so that the film touches the wheel and the layer faces away from the wheel. The wheel is heated to a temperature high enough to transits the polymeric resin into a low-viscosity state. A substrate strip (110), which has been assembled with a plurality of semiconductor chips (101) connected to the substrate by bonding wires (120), is placed on a station (130) also heated to the transition temperature. The wheel is then moved to roll the low viscosity resin on the chips and wires along the strip, while the inert film is separated. The chips and wires are thus encapsulated.

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