Roll forming of semiconductor component leadframes

Details Roll forming of semiconductor component leadframes Roll forming of semiconductor component leadframes

1991-03-04

1991-12-24

Crane, Daniel C.

Metal deforming

By deflecting successively-presented portions of work during...

With cutting of work or product

72181, 72199, 72338, 29827, 140105, B21F 4500

Patent

active

050741390

ABSTRACT:
A method by which leads of a semiconductor component are bent into their final shape using a roll forming process to bend the leads into the desired shape before separation of the individual components. The roll forming process achieves a final form by passing a lead frame holding a plurality of the semiconductor components through a series of form rollers which progressively bend the leads into the final shape. The method can be designed to cut the components free from the lead frame as a final step, minimizing the individual handling of the miniaturized components.

REFERENCES:
patent: 3416348 (1968-12-01), Carter
patent: 3900053 (1975-08-01), Weresch
patent: 4558581 (1985-12-01), Goulstone
patent: 4827669 (1989-05-01), Nakajima

Affiliated with

Also associated with

Rating

Roll forming of semiconductor component leadframes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Roll forming of semiconductor component leadframes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Roll forming of semiconductor component leadframes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-37248