Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions
Patent
1997-06-30
1999-05-11
Mai, Ngoclan
Specialized metallurgical processes, compositions for use therei
Compositions
Consolidated metal powder compositions
419 18, 419 32, 419 33, 419 35, 419 43, C22C29/08
Patent
active
059029420
ABSTRACT:
There is now provided a roll for hot rolling comprising 70-95 weight %, preferably 85-94 weight %, WC in a binder phase consisting of only cobalt or alternatively a Co--Ni--Cr alloy containing 20-35 weight % Ni and up to 10 weight % Cr, possibly with small additions of molybdenum. The WC grains are rounded with an average grain size between 3-10 .mu.m, preferably 4-8 .mu.m. The maximum grain size should not exceed 2 times the average grain size and no more than 2% of the grains be less than half of the average grain size.
REFERENCES:
patent: 3993446 (1976-11-01), Okawa
patent: 4820482 (1989-04-01), Fischer et al.
patent: 5235879 (1993-08-01), Drougge
patent: 5305840 (1994-04-01), Liang et al.
patent: 5403652 (1995-04-01), Drougge
patent: 5418049 (1995-05-01), Drougge
patent: 5441693 (1995-08-01), Ederyd et al.
patent: 5505902 (1996-04-01), Fischer et al.
patent: 5529804 (1996-06-01), Bonneau et al.
patent: 5619000 (1997-04-01), Ederyd et al.
Patent Abstracts of Japan, vol. 096, No. 007, Jul. 31, 1996,, & JP 08 073964 A (Hitachi Metals Ltd), Mar. 19, 1996.
Rhodes, M.J., editor, "Principles of Powder Technology", John Wiley & Sons, Chichester, England, 1990, pp. 259-263.
Ericson Thomas
Fischer Udo
Maderud Carl-Johan
Mai Ngoclan
Sandvik AB
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