Robust thick film conductors

Details Robust thick film conductors Robust thick film conductors

1999-11-11

2000-12-26

Ryan, Patrick

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281231, 22818021, 22818022, 428457, 29829, B23K 3100, B23K 3102, B32B 1504, H05K 300

Patent

active

061645206

ABSTRACT:
A robust thick film conductor construction making an electric circuit connection of an electric component (20) to a Ag:Pd conductor (12) on a substrate. A substantially pure Ag conductor (10) is printed, dried, and fired on the substrate, then the Ag:Pd conductor is printed, dried, and fired such that a portion of the latter overlaps a portion of the Ag conductor. A first solder layer (16) is printed over the Ag conductor, including the overlap region (14), and reflowed. A second solder layer (18) is printed over the first printed solder layer at a region where the component (20) is to be placed and is reflowed after placement of the component to thereby join with the component.

REFERENCES:
patent: 4132341 (1979-01-01), Bratschum
patent: 4739917 (1988-04-01), Baker
patent: 4939022 (1990-07-01), Palanisamy
patent: 5485294 (1996-01-01), Sugiyama et al.
patent: 5803343 (1998-09-01), Sarma et al.
patent: 5803344 (1998-09-01), Stankavich et al.
patent: 5831828 (1998-11-01), Cutting et al.
patent: 5832595 (1998-11-01), Maruyama et al.
patent: 5924623 (1999-07-01), Kenney
patent: 5939969 (1999-08-01), Doerrwachter et al.
patent: 5966067 (1999-10-01), Murakami et al.

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