Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-11-14
2006-11-14
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S692000, C257S696000, C438S111000, C438S123000
Reexamination Certificate
active
07135761
ABSTRACT:
A power semiconductor package, including a leadframe having at least one first terminal, a second terminal and a third terminal. The package also includes a semiconductor power die having a bottom surface defining a first current carrying electrode and a top surface on which a first metalized region defining a second current carrying electrode and a second metalized region defining a control electrode are disposed, the bottom surface being coupled to the leadframe such that the first terminal is electrically connected to the first current carrying electrode. A clip is also coupled to the first metalized region defining the second current carrying electrode and to the second terminal such that it is electrically coupled to the second current carrying electrode.
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Carney Francis J.
Pearse Jeffrey
St. Germain Stephen
Jackson Kevin B.
Pham Long
Rao Shrinivas H.
Semiconductor Components Industries, L.LC
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