Robust electronic device packages

Details Robust electronic device packages Robust electronic device packages

2005-05-17

2005-05-17

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified filler material

C257S789000, C257S687000, C257S678000

Reexamination Certificate

active

06894400

ABSTRACT:
Packages for electronic devices are formed from a die such as a silicon die in electrical communication with a substrate through a mating array, e.g. ball array, on the substrate. An underfill material is present between the die and substrate in the region of the array. For large dies (a dimension of 15 mm or greater) failure of the connection between the die and substrate is avoided by employing a particle filled underfill material with specifically chosen Young moduli both below and above the glass transition temperature of the underfill material.

REFERENCES:
patent: 5953814 (1999-09-01), Sozansky et al.
patent: 6521480 (2003-02-01), Mitchell et al.
Harper, Charles Ed. “Materials for Electronic Packaging” in Elect. Pack. & Interconnect Hdbk, NY :McGraw-Hill, 2000, 6-14, 41-42, 44-46.
Product Data Sheet for ShinEtsu 5125 Nov. 1998.
Product Data Sheet for Sumitomo 4152-R5 Jun. 2002.
Product Data Sheet for Nagase 3423iHX-5 Mar. 2003.
Product Data Sheet for Loctite FP4549 Nov. 2002.
Product Data Sheet for NAMICS U8439-1.
Product Data Sheet for Abelstik RP658-7C.

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