Robot to pedestal alignment head

Geometrical instruments – Gauge – Collocating

Patent

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Details

33644, 33533, 414935, 738659, B23Q 1722, G01B 525

Patent

active

054541700

ABSTRACT:
An apparatus and method for aligning an automated semiconductor wafer handling device with a semiconductor wafer receiving device. An alignment head is attached to the semiconductor wafer handling device in place of a wafer gripper assembly. The alignment head has at least one dial indicator disposed thereon. The ends of the dial indicators are arranged such that they are located in the same position a semiconductor wafer would occupy during normal operation of the automated semiconductor wafer handling device. As the automated semiconductor wafer handling device is activated, the alignment head is brought within close proximity to the semiconductor wafer receiving device. In so doing, the ends of the dial pins contact the surface of the semiconductor wafer receiving device thereby indicating the relative position and alignment of the automated semiconductor wafer handling device with respect to the semiconductor wafer receiving device. In a similar manner, the alignment head also indicates the relative position of the automated semiconductor wafer handling device with respect to a semiconductor wafer dispersing device.

REFERENCES:
patent: 1643570 (1927-09-01), Bartholdy
patent: 3177589 (1965-04-01), Peeler
patent: 3461566 (1969-08-01), Gerstner
patent: 5179863 (1993-01-01), Uchida et al.
patent: 5245759 (1993-09-01), Pearson

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