Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1992-12-21
1995-02-14
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174263, 174255, 361773, 361776, H05K 102
Patent
active
053897439
ABSTRACT:
A ceramic circuit card (10) for a missile utilizing a "rivet" design and a method for making the same wherein thick-film copper I/O pads (15) are fabricated on a first dielectric layer (13) and on the upper surface of conducting material (20) in vias (14) formed in the dielectric layer (13). A first conductor layer (11) is printed directly on an alumina ceramic layer (12). The dielectric layer (13) is then printed on the first conductor layer (11) and on the alumina ceramic layer (12). During operation, each I/O pad (15) has attached to it a flex harness (21) for connecting the card (10) to a printed wiring board (22) on which the card (10) is mounted. The ceramic circuit card (10) is further comprised of additional dielectric and conductor layers in an alternating stacked arrangement. The top conductor layer is used to connect the circuit card to other electrical components.
REFERENCES:
patent: 3888639 (1975-06-01), Hashings et al.
patent: 4268585 (1981-05-01), Daur et al.
patent: 4628410 (1986-12-01), Goodman et al.
patent: 4713494 (1987-12-01), Oikawa et al.
patent: 5035939 (1991-07-01), Conlon et al.
patent: 5111003 (1992-05-01), Kimbara
patent: 5239448 (1993-08-01), Perkins et al.
Mehrotra Mradul
Simila Charles E.
Brown Charles D.
Denson-Low Wanda K.
Heald Randall M.
Hughes Aircraft Company
Picard Leo P.
LandOfFree
Rivet design for enhanced copper thick-film I/O pad adhesion does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Rivet design for enhanced copper thick-film I/O pad adhesion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rivet design for enhanced copper thick-film I/O pad adhesion will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-289050