Rinse apparatus and method for wafer polisher

Details Rinse apparatus and method for wafer polisher Rinse apparatus and method for wafer polisher

2006-04-04

2006-04-04

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Abradant supplying

C451S444000, C451S446000

Reexamination Certificate

active

07021999

ABSTRACT:
An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.

REFERENCES:
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patent: 6899592 (2005-05-01), Kojima et al.
patent: 6908370 (2005-06-01), Jiang et al.
patent: 2005/0124267 (2005-06-01), Jiang et al.

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