Electricity: conductors and insulators – Boxes and housings – With electrical device
Reexamination Certificate
2002-09-30
2008-12-02
Ngo, Hung V (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
With electrical device
C361S727000, C361S728000
Reexamination Certificate
active
07459642
ABSTRACT:
A slot filler module is presented. The slot filler module includes a RIM molded encapsulant, an insert disposed in a predetermined location within the encapsulant and a connector disposed proximate a first end of the RIM molded encapsulant.
REFERENCES:
patent: 4399485 (1983-08-01), Wright et al.
patent: 4894749 (1990-01-01), Elko et al.
patent: 6865092 (2005-03-01), Joist et al.
patent: 6866908 (2005-03-01), Lichtenstein et al.
patent: 2002/0012237 (2002-01-01), Dimarco
patent: 2004/0001320 (2004-01-01), Baar et al.
patent: 2005/0157467 (2005-07-01), Malone et al.
patent: 2005/0157472 (2005-07-01), Malone et al.
Culpepper Martin L.
Girdhar Rohit
Patel Sarosh M.
Daly, Crowley & Mofford & Durkee, LLP
Ngo Hung V
Teradyne, Inc.
LandOfFree
RIM slot filler module and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with RIM slot filler module and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and RIM slot filler module and method of manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4042949