Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2008-03-25
2008-03-25
Culbert, Roberts (Department: 1792)
Etching a substrate: processes
Forming or treating electrical conductor article
C029S846000
Reexamination Certificate
active
11214965
ABSTRACT:
A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at an interface between different materials are avoided.
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patent: 2006-196800 (2006-07-01), None
Kim Dong Kuk
Myung Bum Young
Park Young Po
Yang Dek Gin
Yoon Young Seok
Culbert Roberts
Darby & Darby P.C.
Samsung Electro-Mechanics Co. Ltd.
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