Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2011-01-25
2011-01-25
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S702000, C257SE23065, C174S254000
Reexamination Certificate
active
07875969
ABSTRACT:
A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.
REFERENCES:
patent: 5100492 (1992-03-01), Kober et al.
patent: 5121297 (1992-06-01), Haas
patent: 5428190 (1995-06-01), Stopperan
patent: 5461202 (1995-10-01), Sera et al.
patent: 6373709 (2002-04-01), Hino et al.
patent: 6477052 (2002-11-01), Barcley
patent: 6486408 (2002-11-01), Morris
patent: 6762942 (2004-07-01), Smith
patent: 7371970 (2008-05-01), Flammer et al.
patent: 2001/0003049 (2001-06-01), Fukasawa et al.
patent: 2002/0151210 (2002-10-01), Singh et al.
patent: 2004/0071052 (2004-04-01), Hanaoka et al.
patent: 2004/0112632 (2004-06-01), Michiwaki et al.
patent: 2006/0044749 (2006-03-01), Pauley et al.
patent: 2006/0169485 (2006-08-01), Kawaguchi et al.
Chuo Chih-Heng
Lin Gwun-Jin
Su Kuo-Fu
Advanced Flexible Circuits Co., Ltd.
Parekh Nitin
Rosenberg , Klein & Lee
LandOfFree
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