Rigid/flex printed circuit board using angled prepreg

Details Rigid/flex printed circuit board using angled prepreg Rigid/flex printed circuit board using angled prepreg

1997-05-30

1999-12-07

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Including grain, strips, or filamentary elements in...

428209, 428901, 442228, 442232, 174254, H05K 100, B32B 300

Patent

active

059979836

ABSTRACT:
A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, the conductor layer containing at least one conductive pathway and the flexible insulator layer comprises fibers dispersed in a matrix polymer. The fibers are oriented with respect to the conductive pathway so that the conductive pathway is substantially non-aligned with said fibers, substantially along an entirety of the conductive pathway in the flex section so as to be flexible.

REFERENCES:
patent: 3264524 (1966-08-01), Dahlgren et al.
patent: 3409732 (1968-11-01), Dahlgren et al.
patent: 4035694 (1977-07-01), Barton et al.
patent: 4191800 (1980-03-01), Holtzman
patent: 4368234 (1983-01-01), Palmer et al.
patent: 4446173 (1984-05-01), Barrell et al.
patent: 4446191 (1984-05-01), Miyadera et al.
patent: 4550051 (1985-10-01), Spielan et al.
patent: 4622254 (1986-11-01), Nishimura et al.
patent: 4800461 (1989-01-01), Dixon et al.
patent: 4883700 (1989-11-01), Harpell et al.
patent: 4927581 (1990-05-01), Medwin
patent: 5004639 (1991-04-01), Desai
patent: 5017312 (1991-05-01), Peters et al.
patent: 5114775 (1992-05-01), Gsell et al.
patent: 5121297 (1992-06-01), Haas
patent: 5144742 (1992-09-01), Lucas et al.
patent: 5200246 (1993-04-01), Sabee
patent: 5273819 (1993-12-01), Jex
patent: 5275877 (1994-01-01), Isayev
patent: 5499444 (1996-03-01), Doane, Jr. et al.
"Flexural Fatigue and Ductility, Flexible Printed Wiring" IPC; "IPC-TM-650 Test Methods Manual"; Mar. 1991; pp. 1-3.
The Institute for Interconnecting and Packaging Electronic Circuits IPC; "IPC-TM-650 Test Methods Manual--Adhesion, Solder Mask Flexible Circuits"; Jan. 1996; pp. 1, 5-6.
The Institute for Interconnecting and Packaging Electronic Circuits Thatcher et al; "High Resolution Photoimageable Covercoats for Flex Applications"; pp. 1-15; Coates Circuit Products.

Affiliated with

Also associated with

Rating

Rigid/flex printed circuit board using angled prepreg does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Rigid/flex printed circuit board using angled prepreg, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rigid/flex printed circuit board using angled prepreg will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-821252