Etching a substrate: processes – Forming or treating electrical conductor article
Patent
1999-05-04
2000-08-08
Gulakowski, Randy
Etching a substrate: processes
Forming or treating electrical conductor article
216 17, 216 20, 216 36, 216105, 29846, 205223, 174254, H05K 100, H05K 306
Patent
active
060997451
ABSTRACT:
In a rigid/flex circuit board and fabricating process, patterns of electrical traces are formed by etching conductive layers on outer surfaces of a flexible multi-layer circuit structure. A protective barrier material is deposited on the etched traces using an "electroless" process, such as immersion of the flexible circuit board in an aqueous solution containing ionic tin. The protective barrier material adheres to and encapsulates the copper traces. An outer circuit structure including a bondfilm of epoxy-impregnated fiberglass ("prepreg" bondfilm) and a copper foil layer is laminated onto the flexible circuit structure. The prepreg bondfilm has a window area removed by routing or an equivalent process prior to being laminated to the flexible structure. The window area defines a flex area of the rigid/flex circuit board that will be relatively flexible. The portion of the outer copper foil above the window area of the prepreg bondfilm is then removed using a chemical etchant to which the previously-applied protective barrier material is immune, such as an ammoniacal etching solution. After the copper foil is etched, the protective barrier material in the flex area of the flexible circuit is stripped away. A flexible sealing coating is then applied to the circuit board to cover the edges of the outer laminated circuit structure.
REFERENCES:
patent: 4715928 (1987-12-01), Hamby
patent: 4800461 (1989-01-01), Dixon et al.
patent: 4830704 (1989-05-01), Voss et al.
patent: 4931134 (1990-06-01), Hatkevitz et al.
patent: 5004639 (1991-04-01), Desai
patent: 5095628 (1992-03-01), McKenney et al.
patent: 5175047 (1992-12-01), McKenney et al.
patent: 5178318 (1993-01-01), Edwin et al.
patent: 5262594 (1993-11-01), Edwin et al.
patent: 5639389 (1997-06-01), Schmidt et al.
patent: 5802714 (1998-09-01), Kobayashi et al.
Military Specification MIL-P-13949G "Plastic Sheet, Laminated, Metal Clad (For Printed Wiring Boards)" Feb. 11, 1987.
Demaso Arthur
McKenney Darryl
Wilson Craig
Alanko Anita
Gulakowski Randy
Parlex Corporation
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