Rigid-flex circuit board having a window for an insulated mounti

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174254, 174252, 174255, 361764, 361749, 361761, H05K 102

Patent

active

056168888

ABSTRACT:
A rigid-flex multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single flexible circuit board layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single flexible circuit board layer is less than 2.0 mils thick and includes polyimide. The single flexible circuit board layer provides a heat conductive yet highly electrically insulative mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting area eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.

REFERENCES:
patent: 3760090 (1973-09-01), Fowler
patent: 4539622 (1985-09-01), Akasaki
patent: 4630172 (1986-12-01), Stenerson et al.
patent: 4861272 (1989-08-01), Clark
patent: 5041899 (1991-08-01), Oku et al.
patent: 5045642 (1991-09-01), Ohta et al.
patent: 5306874 (1994-04-01), Biron

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