Rigid circuit board structure using impingement cooling

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 803, 165908, 361415, H05K 720

Patent

active

051969890

ABSTRACT:
A circuit board construction including a circuit board with circuit modules installed on at least one face of the board, and at least one baffle plate connected rigidly to the board. The baffle plate is of approximately the same dimensions as the circuit board and is rigidly connected to it in a parallel, spaced-apart relationship. The baffle plate has openings at selected locations to direct air onto board-mounted circuit modules, and forms one face of an inlet air plenum, the other face of which is one surface of the circuit board to which the baffle plate is attached, or one face of an adjacent surface. The construction thereby provides impingement cooling of its components, and greatly improved structural rigidity of the circuit boards. One of the forms of the device illustrated has a single baffle plate associated with each circuit board, with circuit modules located on either the inner surface or the outer surface of the board. An alternative form of the invention includes a circuit board with circuit modules on both faces, and two baffle plates, one on each side of the circuit board, such that an intake air plenum is formed between each baffle plate and the surface of an adjacent circuit board or baffle plate.

REFERENCES:
patent: 2394060 (1946-02-01), Holmes
patent: 3843910 (1974-10-01), Ringuet
patent: 4148534 (1979-04-01), Veburg
patent: 4277816 (1981-07-01), Dunn et al.
patent: 4296455 (1981-10-01), Leaycraft et al.
patent: 4399484 (1983-09-01), Mayer
patent: 4494171 (1985-01-01), Bland et al.
patent: 4498118 (1985-02-01), Bell
patent: 4648007 (1987-03-01), Garner
patent: 4674004 (1987-06-01), Smith et al.
patent: 4851965 (1989-07-01), Gabuzda et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Rigid circuit board structure using impingement cooling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Rigid circuit board structure using impingement cooling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rigid circuit board structure using impingement cooling will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1356775

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.