Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-12-23
1995-01-31
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 522, 174 523, 174254, 174252, 257668, 257790, 361807, 361809, 361707, 361750, 439 67, 439 77, 439485, H05K 100, H05K 702
Patent
active
053863429
ABSTRACT:
An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a void of the upper surface of the flexible substrate, and is provided with electrical connections to the package leads. A rigid upper protective layer is provided to substantially enclose the integrated circuit die, and at least partially cover the top surface of the upper insulative layer. The integrated circuit device package further comprises a rigid or semi-rigid lower protective layer opposite the upper protective layer. The rigid lower protective layer is prefomed, and preferably is made from a material selected from the group consisting of rigid ceramic, glass, plastic, and combinations thereof. The combination of upper and lower protective layers fore a device package which provides enhanced protection from mechanical and electrical degradation of the packaged device; from injury due to environmental, shipping and handling, storage; and from use conditions. Methods of production are also given.
REFERENCES:
patent: 3676569 (1972-07-01), Thompson
patent: 3950142 (1976-04-01), Brenan et al.
patent: 4105861 (1978-08-01), Hascoe
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 4709122 (1987-10-01), Samuels
patent: 4792843 (1988-12-01), Haghiri-Tehrani et al.
patent: 4800419 (1989-01-01), Long et al.
patent: 4814943 (1989-03-01), Okuaki
patent: 4843225 (1989-06-01), Hoppe
patent: 4985748 (1991-01-01), Belanger, Jr.
patent: 4990719 (1991-02-01), Wright
patent: 5041395 (1991-08-01), Steffen
patent: 5239448 (1993-08-01), Perkins et al.
Computer Search Results (Compilation, not published).
Olin Portfolio (Compilation, not published).
LSI Logic Corporation
Picard Leo P.
Sparks Donald A.
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