Right circular substrate packaging

Electricity: electrical systems and devices – Miscellaneous

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361413, 361398, 339 17M, H05K 114

Patent

active

043994881

ABSTRACT:
Packaging of microelectronics utilizing a series of various size cylinders hich are assembled and sealed from the environment, providing electrical connections out opposite ends of the cylinders and providing for a center opening in the inner cylinder to allow other structure such as a warhead to be mounted therein are aspects of this invention.

REFERENCES:
patent: 3596140 (1971-07-01), Walsh
patent: 3755891 (1973-09-01), Muckelroy et al.
patent: 3763455 (1973-10-01), Confer et al.
patent: 3951493 (1976-04-01), Kozel et al.
patent: 4173035 (1979-10-01), Hoyt

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Right circular substrate packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Right circular substrate packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Right circular substrate packaging will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-817687

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.